Research of the fuse trimming method in wafer test
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Beijing Key Laboratory of Integrated Circuit Testing Technology,Beijing Automation Test Technology Institute, Beijing 100088, China

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TN407

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    Abstract:

    Fuse trimming test is widely used in wafer test process of mixed signal circuit chip, however it’s difficult to control test precision and the test efficiency is low because it has many kinds of types, the control circuit is complex and trimming is easily affected by changing in the resistance. Aiming at the problems, a test system control circuit for serial and parallel architecture of trimming is put forward, and a calculation method of reducing test error is displayed. Finally, the traditional test process is improved and a simplified procedure based on the combined test steps and parallel tests is made out. The test result turns out that this method can effectively improve test efficiency and accuracy.

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History
  • Received:
  • Revised:
  • Adopted:
  • Online: July 21,2016
  • Published: