In the optoelectronic device package, small displacement detection has a great influence on the packaging efficiency between the optical fiber array waveguide components and chips. It analyzes the existing problems optoelectronic packaging, and several displacement measurement methods are compared, proposed a onedimensional displacement resistance strain sensor structure. First, this thesis conclude the equation of microdisplacement and strain using methodology of analyzing the structure of sensor. Then, in this paper demonstrate the process of simulating microdisplacement and strain of sensor, using ANSYS as simulation tool. Finally, the results of theoretical analysis and simulation values obtained were compared. The simulation shows that the novel sensor is capable of detecting micron displacement and has high sensitivity. And bettering the structure of the Elastic slice and adjusting the action spots are viable and valid methods to enhance the sensitivity of sensor.